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<\/span><\/div><\/div>Fifola<\/h1><\/div><\/div><\/div><\/div><\/div>FIFOLA objective is to setup and provide the LED lighting industry with a complete low cost integration chain from the epitaxial layer equipment and process to the full integration of the optical device with its associated electronics packaged onto a flexible substrate.<\/h3><\/div><\/div><\/div><\/div>FIFOLA objective is to setup and provide the LED lighting industry with a complete low cost integration chain from the epitaxial layer equipment and process to the full integration of the optical device with its associated electronics packaged onto a flexible substrate.<\/p>\n
As presented in 2011 Yole LED Packaging Survey, mainly due to manual serial operations, the cost is distributed among all the value chain and the packaging may reach up to 53% of the breakdown.<\/p>\n
Energy conservation drives LED development as light sources for many applications. The 3\u00a0major ones are (1)\u00a0street lighting, (2)\u00a0automotive and (3)\u00a0interior lighting.<\/p>\n
Currently HB LEDs are mostly fitted on regular PCBs, often by a manual operation. This has a number of drawbacks:<\/p>\n
\n- PCBs are rigid. Thus, as LED-based lamps gather many LEDs in order to reach the desired light level, they often have to be installed in a spherical (or so) way so that the beams light properly the target. Rigid PCBs cannot fulfil this requirement.<\/li>\n
- LEDs and their associated circuitries, both optical and electrical, dissipate a high amount of heat, which may alter the optical performances. Heat sinks are needed to remove that heat and need to be integrated flawlessly in the manufacturing process.<\/li>\n<\/ul>\n
In order to improve the industrial level of LED lighting, the following will be setup:<\/p>\n
\n- Wafer processing and metrology equipment will be improved to fit for the different substrates and accommodate dedicated specifications;<\/li>\n<\/ol>\n
\n- GaN \/ Si technology will be refined<\/li>\n
- Dies will be thinned to achieve low thermal resistance<\/li>\n<\/ul>\n
\n- Thermal conductivity between the LED and its command circuitry will be improved to increase device lifetime and to enable the construction of brighter devices.<\/li>\n
- Packaging will be developed in or onto flexible substrate enabling automated integration of all associated devices: electronic (drivers, safety diode, passives\u2026) as well as optical (phosphor, lens\u2026)<\/li>\n<\/ol>\n<\/div><\/div><\/div><\/div>
Actions LCP’s Engineering<\/h3><\/div><\/div><\/div><\/div>
FIFOLA objective is to setup and provide the LED lighting industry with a complete low cost integration chain from the epitaxial layer equipment and process to the full integration of the optical device with its associated electronics packaged onto a flexible substrate.<\/h3><\/div><\/div><\/div><\/div>FIFOLA objective is to setup and provide the LED lighting industry with a complete low cost integration chain from the epitaxial layer equipment and process to the full integration of the optical device with its associated electronics packaged onto a flexible substrate.<\/p>\n
As presented in 2011 Yole LED Packaging Survey, mainly due to manual serial operations, the cost is distributed among all the value chain and the packaging may reach up to 53% of the breakdown.<\/p>\n
Energy conservation drives LED development as light sources for many applications. The 3\u00a0major ones are (1)\u00a0street lighting, (2)\u00a0automotive and (3)\u00a0interior lighting.<\/p>\n
Currently HB LEDs are mostly fitted on regular PCBs, often by a manual operation. This has a number of drawbacks:<\/p>\n
\n- PCBs are rigid. Thus, as LED-based lamps gather many LEDs in order to reach the desired light level, they often have to be installed in a spherical (or so) way so that the beams light properly the target. Rigid PCBs cannot fulfil this requirement.<\/li>\n
- LEDs and their associated circuitries, both optical and electrical, dissipate a high amount of heat, which may alter the optical performances. Heat sinks are needed to remove that heat and need to be integrated flawlessly in the manufacturing process.<\/li>\n<\/ul>\n
In order to improve the industrial level of LED lighting, the following will be setup:<\/p>\n
\n- Wafer processing and metrology equipment will be improved to fit for the different substrates and accommodate dedicated specifications;<\/li>\n<\/ol>\n
\n- GaN \/ Si technology will be refined<\/li>\n
- Dies will be thinned to achieve low thermal resistance<\/li>\n<\/ul>\n
\n- Thermal conductivity between the LED and its command circuitry will be improved to increase device lifetime and to enable the construction of brighter devices.<\/li>\n
- Packaging will be developed in or onto flexible substrate enabling automated integration of all associated devices: electronic (drivers, safety diode, passives\u2026) as well as optical (phosphor, lens\u2026)<\/li>\n<\/ol>\n<\/div><\/div><\/div><\/div>
Actions LCP’s Engineering<\/h3><\/div><\/div><\/div><\/div>
FIFOLA objective is to setup and provide the LED lighting industry with a complete low cost integration chain from the epitaxial layer equipment and process to the full integration of the optical device with its associated electronics packaged onto a flexible substrate.<\/p>\n
As presented in 2011 Yole LED Packaging Survey, mainly due to manual serial operations, the cost is distributed among all the value chain and the packaging may reach up to 53% of the breakdown.<\/p>\n
Energy conservation drives LED development as light sources for many applications. The 3\u00a0major ones are (1)\u00a0street lighting, (2)\u00a0automotive and (3)\u00a0interior lighting.<\/p>\n
Currently HB LEDs are mostly fitted on regular PCBs, often by a manual operation. This has a number of drawbacks:<\/p>\n
- \n
- PCBs are rigid. Thus, as LED-based lamps gather many LEDs in order to reach the desired light level, they often have to be installed in a spherical (or so) way so that the beams light properly the target. Rigid PCBs cannot fulfil this requirement.<\/li>\n
- LEDs and their associated circuitries, both optical and electrical, dissipate a high amount of heat, which may alter the optical performances. Heat sinks are needed to remove that heat and need to be integrated flawlessly in the manufacturing process.<\/li>\n<\/ul>\n
In order to improve the industrial level of LED lighting, the following will be setup:<\/p>\n
- \n
- Wafer processing and metrology equipment will be improved to fit for the different substrates and accommodate dedicated specifications;<\/li>\n<\/ol>\n
- \n
- GaN \/ Si technology will be refined<\/li>\n
- Dies will be thinned to achieve low thermal resistance<\/li>\n<\/ul>\n
- \n
- Thermal conductivity between the LED and its command circuitry will be improved to increase device lifetime and to enable the construction of brighter devices.<\/li>\n
- Packaging will be developed in or onto flexible substrate enabling automated integration of all associated devices: electronic (drivers, safety diode, passives\u2026) as well as optical (phosphor, lens\u2026)<\/li>\n<\/ol>\n<\/div><\/div><\/div><\/div>
Actions LCP’s Engineering<\/h3><\/div>
<\/div><\/div><\/div>
- Wafer processing and metrology equipment will be improved to fit for the different substrates and accommodate dedicated specifications;<\/li>\n<\/ol>\n